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EP3C80 数据表(PDF) 2 Page - Altera Corporation |
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EP3C80 数据表(HTML) 2 Page - Altera Corporation |
2 / 7 page 2 DS-CYTHRML-3.0 Altera Corporation Altera Device Package Information Data Sheet Cyclone III Devices Thermal resistance values for Cyclone III devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board specifications require two signals and two power/ground planes and are available at www.jedec.org. The values are described in Tables 1 through 4. Table 2 provides θJA (junction-to-ambient thermal resistance) values and θJC (junction-to-case thermal resistance) values for Cyclone III devices on a board meeting JEDEC specifications for thermal resistance calculation. Table 1. Thermal Resistance Values for Cyclone III Devices Value Description θJA (C/W) Still Air Junction-to-ambient thermal resistance ( θJA) with no airflow when a heat sink is not being used. θJA (C/W) 100 ft./minute Junction-to-ambient thermal resistance with 100 ft./minute airflow when a heat sink is not being used. θJA (C/W) 200 ft./minute Junction-to-ambient thermal resistance with 200 ft./minute airflow when a heat sink is not being used. θJA (C/W) 400 ft./minute Junction-to-ambient thermal resistance with 400 ft./minute airflow when a heat sink is not being used. θJC (C/W) Junction-to-case thermal resistance ( θJC) for device. θJB (C/W) Junction-to-board thermal resistance ( θJB) for specific board being used. Table 2. Thermal Resistance of Cyclone III Devices for Board Meeting JEDEC Specifications (Part 1 of 2) Device Package θJA (°C/W) Still Air θJA (°C/W) 100 ft./min. θJA (°C/W) 200 ft./min. θJA (°C/W) 400 ft./min. θJC (°C/W) EP3C5 E144 20 17.5 15.4 14 8.4 F256 32.4 28.9 27 25.5 11.7 U256 32.5 29.1 27.2 25.6 12.2 M164 38.2 31.5 29.6 27.9 11.6 EP3C10 E144 20 17.5 15.4 14 8.4 F256 32.4 28.9 27 25.5 11.7 U256 32.5 29.1 27.2 25.6 12.2 M164 38.2 31.5 29.6 27.9 11.6 |
类似零件编号 - EP3C80 |
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类似说明 - EP3C80 |
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