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EP2A15 Datasheet(数据表) 4 Page - Altera Corporation |
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EP2A15 Datasheet(HTML) 4 Page - Altera Corporation |
4 page ![]() 4 Altera Corporation APEX II Programmable Logic Device Family Data Sheet – LogicLockTM incremental design for intellectual property (IP) integration and team-based design – NativeLinkTM integration with popular synthesis, simulation, and timing analysis tools –SignalTap® embedded logic analyzer simplifies in-system design evaluation by giving access to internal nodes during device operation – Support for popular revision-control software packages, including PVCS, RCS, and SCCS Tables 2 and 3 show the APEX II ball-grid array (BGA) and FineLine BGATM device package sizes, options, and I/O pin counts. Notes to Table 3: (1) All APEX II devices support vertical migration within the same package (e.g., the designer can migrate between the EP2A15, EP2A25, and EP2A40 devices in the 672-pin FineLine BGA package). Vertical migration means that designers can migrate to devices whose dedicated pins, configuration pins, LVDS pins, and power pins are the same for a given package across device densities. Migration of I/O pins across densities requires the designer to cross reference the available I/O pins using the device pin-outs. This must be done for all planned densities for a given package type to identify which I/O pins are migratable. (2) I/O pin counts include dedicated clock and fast I/O pins. Table 2. APEX II Package Sizes Feature 672-Pin FineLine BGA 724-Pin BGA 1,020-Pin FineLine BGA 1,508-Pin FineLine BGA Pitch (mm) 1.00 1.27 1.00 1.00 Area (mm2) 729 1,225 1,089 1,600 Length × Width (mm × mm) 27 × 27 35 × 35 33 × 33 40 × 40 Table 3. APEX II Package Options & I/O Pin Count Notes (1), (2) Feature 672-Pin FineLine BGA 724-Pin BGA 1,020-Pin FineLine BGA 1,508-Pin FineLine BGA EP2A15 492 492 EP2A25 492 536 EP2A40 492 536 735 EP2A70 536 1,060 |