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CSD-20H-0.9G 数据表(PDF) 1 Page - Merrimac Industries, Inc. |
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CSD-20H-0.9G 数据表(HTML) 1 Page - Merrimac Industries, Inc. |
1 / 5 page DIRECTIONAL COUPLER CSD-20H-0.9G Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006 Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com TECHNICAL DESCRIPTION / APPLICATION MULTI-MIX ® DIRECTIONAL COUPLERS The Multi-Mix ® CSD series provides directional couplers with low insertion loss, low VSWR, and high directivity. Precise coupling and frequency sensitivity make them ideal for applications power ampli- fiers, signal distribution and processing. CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform- ance that is superior to conventional adhesive bonding techniques. The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applica- tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding. Additional benefits include: • Available on tape and reel • Cost effective for commercial wireless applications • Industry standard size • Temperature stable from –65 to +125 degrees C. • Can be integrated with other Multi-Mix ® components in a multi-function module RELIABILITY All CSD series components are 100% tested. The product family has passed environmental screening per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles). THE MULTI-MIX ® PROCESS Multi-Mix ® is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono- lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plat- ed-through vias to form a SMD module that requires no additional packaging and is ready for pick and place. • 0.8 - 1.0 GHz • LOWEST LOSS • HIGHEST ISOLATION • BEST PHASE/AMPLITUDE BALANCE • SURFACE MOUNT • TAPE & REEL REV: 002, 02/13/03 AVAILABLE ON TAPE & REEL THE MULTI-MIX MICROTECHNOLOGY ® GROUP IS ISO-9001 REGISTERED |
类似零件编号 - CSD-20H-0.9G |
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类似说明 - CSD-20H-0.9G |
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