Precise coupling and frequency sensitivity make them ideal for applications power amplifiers, signal

distribution and processing.

CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance

that is superior to conventional adhesive bonding techniques.

The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applications.

The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common

substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM

shielding.

Additional benefits include:

•

Available on tape and reel.

•

Cost effective for commercial wireless applications.

•

Industry standard size.

•

Temperature stable from –65 to +125 degrees C.

•

RELIABILITY

All CSD series components are 100% tested. The product family has passed environmental screening per

MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture

Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).

together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure

with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can

contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through vias to

form a SMD module that requires no additional packaging and is ready for pick and place.

REV: 010, 02/13/03

DIRECTIONAL COUPLERS

CSD-10H-1.9G

Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

TECHNICAL DESCRIPTION / APPLICATION

• 1.8 - 2.0 GHz

• LOWEST LOSS

• HIGHEST ISOLATION

• BEST PHASE/AMPLITUDE BALANCE

• SURFACE MOUNT

• TAPE & REEL

AVAILABLE ON

TAPE & REEL