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A1225DX-VQB 数据表(PDF) 14 Page - Actel Corporation |
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A1225DX-VQB 数据表(HTML) 14 Page - Actel Corporation |
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14 / 84 page  Inte gra t or Serie s FP GAs: 1 200XL a nd 3200 DX F amilie s 14 Discontinued – v3.0 Pa ckage T hermal Char acte rist i cs The device junction to case thermal characteristic is θ jc, and the junction to ambient air characteristic is θ ja. The thermal characteristics for θ ja are shown with two different air flow rates. Maximum junction temperature is 150°C. A sample calculation of the absolute maximum power dissipation allowed for a PQFP 160-pin package with still air at commercial temperature is as follows: Max. junction temp. (°C) – Max. commercial temp. θ ja (°C/W) ----------------------------------------------------------------------------------------------------------------------------- 150°C – 70°C 34°C/W --------------------------------- 2.4W == Package Type Pin Count θ ja Maximum Power Dissipation Still Air 300 ft/min Still Air 300 ft/min Plastic Quad Flat Pack 100 42°C/W 33°C/W 1.9 W 2.4 W Plastic Quad Flat Pack 144 36°C/W 29°C/W 2.2 W 2.8 W Plastic Quad Flat Pack 160 34°C/W 27°C/W 2.4 W 3.0 W Plastic Quad Flat Pack 208 25°C/W 16.2°C/W 3.2 W 4.9 W Plastic Leaded Chip Carrier 84 37°C/W 28°C/W 2.2 W 2.9 W Thin Quad Flat Pack 176 32°C/W 25°C/W 2.5 W 3.2 W Power Quad Flat Pack 208 16.8°C/W 11.4°C/W 4.8 W 7.0 W Power Quad Flat Pack 240 16.1°C/W 10.6°C/W 5.0 W 7.5 W Very Thin Quad Flat Pack 100 43°C/W 35°C/W 1.9 W 2.3 W Po wer Dissipatio n General P o wer E q uation P = [ICCstandby + ICCactive] * VCC + IOL* VOL* N + IOH * (VCC – VOH) * M where: ICCstandby is the current flowing when no inputs or outputs are changing. ICCactive is the current flowing due to CMOS switching. IOL, IOH are TTL sink/source currents. VOL, VOH are TTL level output voltages. N equals the number of outputs driving TTL loads to VOL. M equals the number of outputs driving TTL loads to VOH. An accurate determination of N and M is problematic because their values depend on the family type, design details, and on the system I/O. The power can be divided into two components: static and active. S t ati c Po wer Co mpon en t Actel FPGAs have small static power components that result in lower power dissipation than PALs or PLDs. By integrating multiple PALs/PLDs into one FPGA, an even greater reduction in board-level power dissipation can be achieved. The power dissipation due to standby current is typically a small component of the overall power. Standby power is calculated below for commercial worst case conditions. ICC VCC Power 2 mA 5.25 V 10.5 mW The static power dissipation by TTL loads depends on the number of outputs driving HIGH or LOW and the DC load current. Again, this number is typically small. For instance, a 32-bit bus sinking 4 mA at 0.33V will generate 42 mW with all outputs driving LOW and 140 mW with all outputs driving HIGH. The actual dissipation will average somewhere in between as I/Os switch states with time. Active P o wer C o mponent Power dissipation in CMOS devices is usually dominated by the active (dynamic) power dissipation. This component is frequency-dependent, a function of the logic and the external I/O. Active power dissipation results from charging internal chip capacitances of the interconnect, unprogrammed antifuses, module inputs, and module outputs, plus external capacitance due to PC board traces and load device inputs. An additional component of the active power dissipation is the totem pole current in the CMOS transistor pairs. The net effect can be associated with an equivalent capacitance that can be combined with frequency and voltage to represent active power dissipation. |
类似零件编号 - A1225DX-VQB |
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类似说明 - A1225DX-VQB |
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