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LT1764ET-1.8 数据表(PDF) 19 Page - Linear Technology |
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LT1764ET-1.8 数据表(HTML) 19 Page - Linear Technology |
19 / 20 page 19 LT1764 Series 1764fb FE Package 16-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663) Exposed Pad Variation BB Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTION FE16 (BB) TSSOP 0204 0.09 – 0.20 (.0035 – .0079) 0 ° – 8° 0.25 REF 0.50 – 0.75 (.020 – .030) 4.30 – 4.50* (.169 – .177) 13 4 5 6 7 8 10 9 4.90 – 5.10* (.193 – .201) 16 1514 13 12 11 1.10 (.0433) MAX 0.05 – 0.15 (.002 – .006) 0.65 (.0256) BSC 2.94 (.116) 0.195 – 0.30 (.0077 – .0118) TYP 2 RECOMMENDED SOLDER PAD LAYOUT 0.45 ±0.05 0.65 BSC 4.50 ±0.10 6.60 ±0.10 1.05 ±0.10 2.94 (.116) 3.58 (.141) 3.58 (.141) MILLIMETERS (INCHES) *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE SEE NOTE 4 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT 6.40 (.252) BSC |
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类似说明 - LT1764ET-1.8 |
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