SI5424DC-T1-E3 datasheet(1/7 Pages) VISHAY

部件名	SI5424DC-T1-E3

功能描述	N-Channel 30-V (D-S) MOSFET

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制造商	VISHAY [Vishay Siliconix]

网页	http://www.vishay.com

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FEATURES

D TrenchFETr Power MOSFET

APPLICATIONS

D Load Switch

– Notebook PC

RoHS

COMPLIANT

Si5424DC

Vishay Siliconix

New Product

Document Number: 73776

S–60216—Rev. A, 20-Feb-06

www.vishay.com

1

N-Channel 30-V (D-S) MOSFET

PRODUCT SUMMARY

VDS (V)

rDS(on) (W)

ID (A)a

Qg (Typ)

30

0.024 at VGS = 10 V

6

11 nC

30

0.030 at VGS = 4.5 V

6

11 nC

Marking Code

AF

XXX

Lot Traceability

and Date Code

Part # Code

Ordering Information: Si5424DC–T1–E3 (Lead (Pb)–free)

N-Channel MOSFET

G

D

S

ChipFET 1206-8

D

G

D

S

1

Bottom View

ABSOLUTE MAXIMUM RATINGS (TA = 25 _C UNLESS OTHERWISE NOTED)

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

VDS

30

V

Gate-Source Voltage

VGS

" 25

V

TC = 25 _C

6a

Continuous Drain Current (TJ = 150 _C)

TC = 70 _C

ID

6a

Continuous Drain Current (TJ = 150 _C)

TA = 25 _C

ID

6a

TA = 70 _C

6a

A

Pulsed Drain Current

IDM

40

A

Continuous Source Drain Diode Current

TC = 25 _C

IS

5.2a

Continuous Source-Drain Diode Current

TA = 25 _C

IS

2.1b, c

Avalanche Current

L=01mH

IAS

16

Single Pulse Avalanche Energy

L = 0.1 mH

EAS

12.8

mJ

TC = 25 _C

6.25

Maximum Power Dissipation

TC = 70 _C

PD

4.0

W

Maximum Power Dissipation

TA = 25 _C

PD

2.5b, c

W

TA = 70 _C

1.6b, c

Operating Junction and Storage Temperature Range

TJ, Tstg

– 55 to 150

_C

Soldering Recommendations (Peak Temperature)d, e

260

_C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambientb, f

t

p 5 sec

RthJA

40

50

_C/W

Maximum Junction-to-Foot (Drain)

Steady State

RthJF

15

20

_C/W

Notes:

a.

Package limited.

b.

Surface Mounted on 1” x 1” FR4 Board.

c.

t = 5 sec.

d.

See Solder Profile (http://www.vishay.com/doc?73257). The ChipFET 1206–8 is a leadless package. The end of the lead terminal is exposed copper (not

plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure

adequate bottom side solder interconnection.

e.

Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f.

Maximum under steady state conditions is 80

_C/W.

类似零件编号 - SI5424DC-T1-E3

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Vishay Siliconix	SI5424DC-T1-E3	236Kb / 11P	N-Channel 30-V (D-S) MOSFET Rev. B, 29-Dec-08

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