MCZ33880EW datasheet(5/25 Pages) FREESCALE

部件名	MCZ33880EW

功能描述	Configurable Octal Serial Switch with Serial Peripheral Interface I/O

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制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

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Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33880

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

VDD Supply Voltage (1)

VDD

-0.3 to 7.0

VDC

CS, DI, DO, SCLK, IN5, IN6, and EN (1)

–

-0.3 to 7.0

VDC

VPWR Supply Voltage (1)

VPWR

-16 to 50

VDC

Drain 1–8 (2)

5.0 mA

≤ IOUT ≤ 0.3 A

–

-18 to 40

VDC

Source 1–8 (3)

5.0 mA

≤ IOUT ≤ 0.3 A

–

-28 to 40

VDC

Output Voltage Clamp Low-Side Drive (4)

VOC

40 to 55

VDC

Output Voltage Clamp High-Side Drive (4)

VOC

-15 to -25

VDC

Output Clamp Energy (5)

ECLAMP

50

mJ

ESD Voltage (6)

Human Body Model

Machine Model

VESD1

VESD2

±2000

±200

V

Storage Temperature

TSTG

-55 to 150

°C

Operating Case Temperature

TC

-40 to 125

°C

Operating Junction Temperature

TJ

-40 to 150

°C

Maximum Junction Temperature

–

-40 to 150

°C

Power Dissipation (TA = 25°C) (7)

28 SOIC, Case 751F-05

32 SOIC, Case 1324-02

PD

1.3

1.7

W

Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05

RθJA

94

°C/W

Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02

Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02

RθJA

RθJL

70

18

°C/W

Peak Package Reflow Temperature During Reflow (5), (6)

TPPRT

Note 6

°C

Notes

1.

Exceeding these limits may cause malfunction or permanent damage to the device.

2.

Configured as low-side driver with 300 mA load as current limit.

3.

Configured as high-side driver with 300 mA load as current limit.

4.

With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.

5.

Maximum output clamp energy capability at 150

°C junction temperature using single non-repetitive pulse method.

6.

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed

in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

7.

Maximum power dissipation with no heatsink used.

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