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L6722TR 数据表(PDF) 9 Page - STMicroelectronics |
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L6722TR 数据表(HTML) 9 Page - STMicroelectronics |
9 / 34 page L6722 2 Pins description and connection diagrams 9/34 23 OSC / INH / FLT Three functional pin: OSC: It allows programming the switching frequency FSW of each channel: the equivalent switching frequency at the load side results in being tripled. Frequency is programmed according to the resistor connected from the pin vs. SGND or VCC with a gain of 4kHz/µA (see relevant section for details). Leaving the pin floating programs a switching frequency of 100kHz per phase (300kHz on the load). INH: Forced low, the device stops operations with all mosfets OFF: all the protections are disabled except for Preliminary over voltage. It resets the device from any latching condition. FLT: The pin is forced high (5V) to signal an OVP FAULT: to recover from this condition, cycle VCC or the OSC pin. See Section 10 for details. 24 N.C. Not Internally Bonded. 25 REF_IN REFrence INput for the regulation. Connect directly or through a resistor to the REF_OUT pin. See Section 7.1 for details. 26 REF_OUT REFrence OUTput. Connect directly or through a resistor to the REF_IN pin. See Section 7.1 for details. 27, 28 N.C. Not Internally Bonded. 29 SGND All the internal references are referred to this pin. Connect to the PCB Signal Ground. 30 FBR Remote Buffer Non Inverting Input. Connect to the positive side of the load to perform remote sense. See Section 12 for proper layout of this connection. 31 FBG Remote Buffer Inverting Input. Connect to the negative side of the load to perform remote sense. See Section 12 for proper layout of this connection. 32 to 34 ISEN3 to ISEN1 LS Current Sense Pins. These pins are used for current balance phase-to-phase as well as for the system OCP. Connect through a resistor Rg to the relative PHASEx pin. See Section 6 and Section 9.6 for details. 35 CS+ Droop Current Sense non-inverting input. Connect through R-C network to the main inductors. See Section 7.1 for details. 36 CS- Droop Current Sense inverting input. Connect through resistor RD to the main inductors common node. See Section 7.1 for details. This pin also monitor the feedback disconnection. See Section 9.4 for details. PAD THERMAL PAD Thermal pad connects the Silicon substrate and makes good thermal contact with the PCB to dissipate the power necessary to drive the external mosfets. Connect to the PGND plane with several VIAs to improve thermal conductivity. Table 1. Pins description (continued) Pin# Name Function |
类似零件编号 - L6722TR |
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类似说明 - L6722TR |
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