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BAT3007JFILM 数据表(PDF) 4 Page - STMicroelectronics |
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BAT3007JFILM 数据表(HTML) 4 Page - STMicroelectronics |
4 / 12 page Characteristics BAT30 Series 4/12 Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SOT-666) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-523) Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (SOD-323) Figure 8. Leakage current versus reverse applied voltage (typical values) 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Single pulse SOT-666 Epoxy FR4 e CU=35 µm (s) tP Z th(j-a)/Rth(j-a) 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Single pulse SOD-523 Epoxy FR4 e CU=35 µm Z th(j-a)/Rth(j-a) (s) tP 200 300 400 500 600 0 5 10 15 20 25 30 35 40 45 50 R th(j-a)(°C/W) Epoxy FR4 e CU=35 µm SCU(mm²) 1.E-07 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 0 5 10 15 20 25 30 I R (A) T j=150°C T j=25°C T j=85°C T j=125°C VR (V) Figure 9. Relative variation of reverse leakage current versus junction temperature (typical values) Figure 10. Junction capacitance versus reverse applied voltage (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 -40 -20 0 20 40 60 80 100 120 140 160 I R[Tj]/ IR[Tj=25°C] V R=30 V Tj(°C) 1 10 100 1 10 100 C(pF) F=1 MHz V OSC=30 mVRMS T j=25 °C VR(V) |
类似零件编号 - BAT3007JFILM |
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类似说明 - BAT3007JFILM |
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