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TPA2014D1RGPT 数据表(PDF) 2 Page - Texas Instruments |
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TPA2014D1RGPT 数据表(HTML) 2 Page - Texas Instruments |
2 / 27 page DEVICE INFORMATION V CCFB SDd V DD RGP (QFN)Package (TopView) 1 5 6 10 11 15 16 20 GAIN AGND VOUT– VOUT– VOUT+ VOUT+ VOUT+ V CCFB SW V CCOUT V CCIN SDb IN+ IN– PGND AGND SDd PGND VOUT– V DD GAIN VOUT+ PGND D1 D2 D3 D4 C1 C2 C3 C4 B1 B3 B4 B2 A1 A2 A3 A4 YZH (WCSP)Package (TopView) TPA2014D1 SLAS559A – MAY 2008 – REVISED JUNE 2008 ............................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. BOOST CONVERTER TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME QFN WCSP IN+ 8 D2 I Positive audio input IN– 7 D3 I Negative audio input VOUT+ 13, 14, 15 B1 O Positive audio output VOUT– 11, 12 C1 O Negative audio output SDb 6 D4 I Shutdown terminal for the Boost Converter SDd 5 C3 I Shutdown terminal for the Class D Amplifier SW 18, 19 A3 – Boost and rectifying switch input VCCOUT 17 A2 – Boost converter output - connect to VCCIN GAIN 3 B2 I Gain selection pin VCCIN 16 A1 – Class-D audio power amplifier voltage supply - connect to VCCOUT VCCFB 2 B3 I Voltage feedback VDD 1 B4 – Supply voltage AGND 4 C4 – Analog ground - connect all GND pins together PGND 9, 10, 20 D1, C2, A4 – Power ground - connect all GND pins together Thermal Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. Die Pad N/A P Pad It is required for mechanical stability and will enhance thermal performance. 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2014D1 |
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