www.ti.com

FEATURES

3

2

4

6

1

1A

1Y

2Y

GND

2A

DBV PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

DCK PACKAGE

(TOP VIEW)

3

2

4

6

1

1A

1Y

2Y

GND

2A

3

2

4

6

1

1A

1Y

2Y

GND

2A

1A

2A

1Y

2Y

GND

DRL PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

1

4

2

3

6

5

5

5

5

DESCRIPTION/ORDERING INFORMATION

SN74LVC2G04

DUAL INVERTER GATE

SCES195L – APRIL 1999 – REVISED JANUARY 2007

• Available in the Texas Instruments

• I

NanoFree™ Package

Operation

• Supports 5-V V

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• Inputs Accept Voltages to 5.5 V

• ESD Protection Exceeds JESD 22

• Max t

–

2000-V Human-Body Model (A114-A)

• Low Power Consumption, 10-µA Max I

CC

–

200-V Machine Model (A115-A)

• ±24-mA Output Drive at 3.3 V

–

1000-V Charged-Device Model (C101)

• Typical V

at V

• Typical V

V

function Y = A.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74LVC2G04YZPR

_ _ _CC_

(Pb-free)

Reel of 3000

SN74LVC2G04DBVR

SOT (SOT-23) – DBV

C04_

–40

°C to 85°C

Reel of 250

SN74LVC2G04DBVT

Reel of 3000

SN74LVC2G04DCKR

SOT (SC-70) – DCK

CC_

Reel of 250

SN74LVC2G04DCKT

SOT (SOT-563) – DRL

Reel of 4000

SN74LVC2G04DRLR

CC_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Copyright © 1999–2007, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.