SM15Txx

4/5

Fig. 6 : Transient thermal impedance junc-

tion-ambient versus pulse duration.

Mounting on FR4 PC Board with recommended

pad layout.

Fig. 5 : Peak forward voltage drop versus peak

forward current (typical values for unidirectional

types).

Fig. 4b : Capacitance versus reverse applied

voltage for bidirectional types (typical values).

Fig. 4a : Capacitance versus reverse applied

voltage for unidirectional types (typical values).

Fig. 7 : Relative variation of leakage current

versus junction temperature.