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SN74LVC1G139DCUR 数据表(PDF) 1 Page - Texas Instruments |
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SN74LVC1G139DCUR 数据表(HTML) 1 Page - Texas Instruments |
1 / 15 page www.ti.com FEATURES abc Y1 3 2 5 8 1 A VCC B GND DCT PACKAGE (TOP VIEW) YEP OR YZP PACKAGE (BOTTOM VIEW) DCU PACKAGE (TOP VIEW) 3 2 4 5 1 A VCC Y0 B GND B GND VCC Y2 Y3 See mechanical drawings for dimensions. 2 5 3 4 8 Y3 Y1 Y2 Y3 Y0 Y2 4 6 7 6 7 8 6 1 7 A Y1 Y0 DESCRIPTION/ORDERING INFORMATION SN74LVC1G139 2-TO-4 LINE DECODER SCES602B – AUGUST 2004 – REVISED DECEMBER 2005 • Available in the Texas Instruments • Latch-Up Performance Exceeds 100 mA Per NanoStar™ and NanoFree™ Packages JESD 78, Class II • Supports 5-V V CC Operation • ESD Protection Exceeds JESD 22 • Inputs Accept Voltages to 5.5 V – 2000-V Human-Body Model (A114-A) • Max t pd of 4.9 ns at 3.3 V – 200-V Machine Model (A115-A) • Low Power Consumption, 10- µA Max I CC – 1000-V Charged-Device Model (C101) • ±24-mA Output Drive at 3.3 V • I off Supports Partial-Power-Down Mode Operation This 2-to-4 line decoder is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, this decoder can be used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC1G139YEPR 0.23-mm Large Bump – YEP Reel of 3000 _ _ _C9_ NanoFree™ – WCSP (DSBGA) SN74LVC1G139YZPR 0.23-mm Large Bump – YZP (Pb-free) –40 °C to 85°C Reel of 3000 SN74LVC1G139DCTR SSOP – DCT C39_ _ _ Reel of 250 SN74LVC1G139DCTT Reel of 3000 SN74LVC1G139DCUR VSSOP – DCU C39_ Reel of 250 SN74LVC1G139DCUT (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2004–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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类似说明 - SN74LVC1G139DCUR |
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