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MC33164-3 数据表(PDF) 2 Page - Microsemi Corporation |
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MC33164-3 数据表(HTML) 2 Page - Microsemi Corporation |
2 / 9 page 3V U NDER V O L T AGE S ENSING C IRCUIT MC33164-3/MC34164-3 PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.2a 11/04 2 P RODUCTION D AT A S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Input Supply Voltage (V IN) ............................................................................... -1V to 12V RESET Output Voltage (V OUT) ..................................................................................... 12V Output Sink Current (I OL) ............................................................ Internally Limited (mA) Clamp Diode Forward Current (I F), Pin 1 to pin 2 ............................................... 100mA Operating Junction Temperature Plastic (DM, LP - Packages) .................................................................................. 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C PACKAGE PIN OUTS RESET V IN N.C. GROUND N.C. N.C. N.C. N.C. DM PACKAGE (Top View) Note 1. Values beyond which damage may occur. All voltages are specified with respect to ground, and all currents are positive into the specified terminal. DM PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 165°C/W LP PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 156°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow THERMAL DATA BLOCK DIAGRAM LP PACKAGE (Top View) 3. GROUND 2. V IN 1. RESET 1.2 V REF V IN RESET GROUND 1 8 2 7 3 6 4 5 Peak Package Solder Reflow Temp. (40 second max. exposure).......................................... 260°C (+0, -5) RoHS / Pb-free 100% Matte Tin Lead Finish |
类似零件编号 - MC33164-3 |
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类似说明 - MC33164-3 |
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