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SN74LVC1G132DCKR 数据表(PDF) 1 Page - Texas Instruments

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部件名 SN74LVC1G132DCKR
功能描述  SINGLE 2-INPUT NAND GATE WITH SCHMITT-TRIGGER INPUTS
Download  15 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

SN74LVC1G132DCKR 数据表(HTML) 1 Page - Texas Instruments

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www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DBVPACKAGE
(TOP VIEW)
5
1
V
CC
A
2
B
3
4
GND
Y
DCKPACKAGE
(TOP VIEW)
2
B
3
4
GND
V
CC
5
A
Y
1
YEP OR YZP PACKAGE
(BOTTOMVIEW)
2
B
V
CC
1 5
A
GND
4
3
Y
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G132
SINGLE 2-INPUT NAND GATE
WITH SCHMITT-TRIGGER INPUTS
SCES546B – FEBRUARY 2004 – REVISED SEPTEMBER 2006
Ioff Supports Partial-Power-Down Mode
Operation
Available in Texas Instruments NanoStar™
and NanoFree™ Packages
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Supports 5-V VCC Operation
ESD Protection Exceeds JESD 22
Inputs Accept Voltages to 5.5 V
– 2000-V Human-Body Model (A114-A)
Max tpd of 5.3 ns at 3.3 V
– 200-V Machine Model (A115-A)
Low Power Consumption, 10-
µA Max I
CC
– 1000-V Charged-Device Model (C101)
±24-mA Output Drive at 3.3 V
The SN74LVC1G132 contains one 2-input NAND gate with Schmitt-trigger inputs designed for 1.65-V to 5.5-V
VCC operation and performs the Boolean function Y = A • B or Y = A + B in positive logic.
Because of Schmitt action, this device has different input threshold levels for positive-going (VT+) and
negative-going (VT–) signals.
This device can be triggered from the slowest of input ramps and still give clean jitter-free output signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
SN74LVC1G132YEPR
0.23-mm Large Bump – YEP
Reel of 3000
_ _ _D5_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
SN74LVC1G132YZPR
(Pb-free)
–40°C to 85°C
Reel of 3000
SN74LVC1G132DBVR
SOT (SOT-23) – DBV
C3B_
Reel of 250
SN74LVC1G132DBVT
Reel of 3000
SN74LVC1G132DCKR
SOT (SC-70) – DCK
D5_
Reel of 250
SN74LVC1G132DCKT
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
• = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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