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M27V800-150F1TR 数据表(PDF) 5 Page - STMicroelectronics |
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M27V800-150F1TR 数据表(HTML) 5 Page - STMicroelectronics |
5 / 16 page 5/16 M27V800 Table 7. Read Mode DC Characteristics (1) (TA = 0 to 70 °C; VCC = 3.3V ± 10%; VPP =VCC) Note: 1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 2. Maximum DC voltage on Output is VCC +0.5V. Symbol Parameter Test Condition Min Max Unit ILI Input Leakage Current 0V ≤ VIN ≤ VCC ±1 µA ILO Output Leakage Current 0V ≤ VOUT ≤ VCC ±10 µA ICC Supply Current E=VIL,G= VIL,IOUT = 0mA, f = 8MHz, VCC ≤ 3.6V 30 mA E=VIL,G= VIL,IOUT = 0mA, f = 5MHz, VCC ≤ 3.6V 20 mA ICC1 Supply Current (Standby) TTL E= VIH 1mA ICC2 Supply Current (Standby) CMOS E> VCC –0.2V, VCC ≤ 3.6V 20 µA IPP Program Current VPP =VCC 10 µA VIL Input Low Voltage –0.3 0.8 V VIH (2) Input High Voltage 2 VCC +1 V VOL Output Low Voltage IOL = 2.1mA 0.4 V VOH Output High Voltage TTL IOH = –400µA 2.4 V For the most efficient use of these two control lines, E should be decoded and used as the prima- ry device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselect- ed memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. System Considerations The power switching characteristics of Advanced CMOS EPROMs require carefull decoupling of the supplies to the devices. The supply current ICC has three segments of importance to the system designer: the standby current, the active current and the transient peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependant on the capacititive and inductive load- ing of the device outputs. The associated transient voltage peaks can be supressed by complying with the two line output control and by properly se- lected decoupling capacitors. It is recommended that a 0.1 µF ceramic capacitor is used on every device between VCC and VSS. This should be a high frequency type of low inherent inductance and should be placed as close as possible to the device. In addition, a 4.7 µF electrolytic capacitor should be used between VCC and VSS for every eight devices. This capacitor should be mounted near the power supply connection point. The pur- pose of this capacitor is to overcome the voltage drop caused by the inductive effects of PCB trac- es. |
类似零件编号 - M27V800-150F1TR |
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类似说明 - M27V800-150F1TR |
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