LUXEON III Emitter DS45 (3/06)

8

Table 10.

T

Te

em

mp

pe

erra

attu

urre

e

C

Co

oe

effffiic

ciie

en

ntt o

off

T

Th

he

errm

ma

all

F

Fo

orrw

wa

arrd

d

R

Re

es

siis

stta

an

nc

ce

e,,

D

Dy

yn

na

am

miic

c

V

Vo

olltta

ag

ge

J

Ju

un

nc

cttiio

on

n

F

Fo

orrw

wa

arrd

d V

Vo

olltta

ag

ge

e V

V

F

R

Re

es

siis

stta

an

nc

ce

((m

mV

C))

tto

o C

Ca

as

se

e

C

Co

ollo

orr

M

Miin

n..

T

Ty

yp

p..

M

Ma

ax

x..

((Ω

Ω)) R

R

D

D

∆∆VV

F

/

∆∆TT

J

J

C//W

W)) R

R

θθ

J

J C

C

Red

2.31

2.95

3.51

0.7

2.0

6

RedOrange

2.31

2.95

3.51

0.7

2.0

6

Amber

2.31

2.95

3.51

0.7

2.0

6

Notes for Table 10:

1. Lumileds maintains a tolerance of ± 0.06V on forward voltage measurements.

2. Dynamic resistance is the inverse of the slope in linear forward voltage model for LEDs. See Figure 3.

3. Measured between 25ºC

≤ T

J

≤ 110ºC at I

Absolute Maximum Ratings

Table 11.

W

Wh

hiitte

e//G

Grre

ee

en

n//

R

Re

ed

d//

C

Cy

ya

an

n//B

Bllu

ue

e//

R

Re

ed

d O

Orra

an

ng

ge

e//

P

Pa

arra

am

me

ette

err

R

Ro

oy

ya

all B

Bllu

ue

e

A

Am

mb

be

err

DC Forward Current (mA)

[1]

1000

1540

Peak Pulsed Forward Current (mA)

1000

2200

Average Forward Current (mA)

1000

1400

LED Junction Temperature (ºC)

135

135

Storage Temperature (ºC)

40 to +120

40 to +120

Soldering Temperature (ºC)

[2]

260 for

260 for

5 seconds max

5 seconds max

ESD Sensitivity

[3]

±16,000V HBM

±16,000V HBM

Notes for Table 11:

1. Proper current derating must be observed to maintain junction temperature below the maximum. For more

information, consult the Luxeon Design Guide, available upon request.

2. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120ºC. Luxeon Emitters cannot

be soldered by general IR or Vaporphase reflow, nor by wave soldering. Lead soldering is limited to selective heating of the

leads, such as by hotbar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may not be attached by

soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and the board is required.

Please consult Lumileds' Application Brief AB10 on Luxeon Emitter Assembly Information for further details on assembly

methods.

3. LEDs are not designed to be driven in reverse bias. Please consult Lumileds' Application Brief AB11 for further information.