BTA20 BW/CW

BTB20 BW/CW

4/6

Fig. 3: Correlation between maximum RMS power

dissipation and maximum allowable temperatures

(Tamb and Tcase) for different thermal resistances

heatsink + contact (BTB).

Fig. 4: RMS on-state current versus case temper-

ature.

1E-3

1E-2

1E-1

1E+0

1E+1

1E +2 5E+2

0.01

0.1

1

Zth/Rth

Zth(j-c)

Zth(j-a)

tp(s)

Fig. 5: Relative variation of thermal impedance

versus pulse duration.

Fig. 6: Relative variation of gate trigger current

and holding current versus junction temperature.

Fig. 1: Maximum RMS power dissipation versus

RMS on-state current (F = 50Hz).(Curves are cut

off by (dI/dt)c limitation)

Fig. 2: Correlation between maximum RMS power

dissipation and maximum allowable temperatures

(Tamb and Tcase) for different thermal resistances

heatsink + contact (BTA).