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TSC2004IYZKR 数据表(PDF) 5 Page - Burr-Brown (TI) |
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TSC2004IYZKR 数据表(HTML) 5 Page - Burr-Brown (TI) |
5 / 54 page www.ti.com PIN CONFIGURATION X Y SNSGND NC AD0 - - TSC2004 16 17 18 19 20 10 9 8 7 6 ThermalPad 1 2 3 4 5 15 14 13 12 11 AGND AUX NC I/OVDD DGND Columns (FRONT VIEW) A C E B D NC AD1 SNSGND NC DGND 4 NC NC Y - I/OVDD 3 SUBGND NC X - AUX 2 X+ VREF Y+ SNSVDD AGND 1 SDA PINTDAV AD0 SCL RESET 5 NC TSC2004 SBAS408A – JUNE 2007 – REVISED AUGUST 2007 RTJ PACKAGE(1) YZK PACKAGE QFN-20 WCSP-18 (TOP VIEW) (TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE) (1) The thermal pad is internally connected to SUBGND. The thermal pad can be connected to the analog ground or left floating. Keep the thermal pad separate from the digital ground, if possible. PIN ASSIGNMENTS PIN NO. PIN QFN WCSP NAME I/O A/D DESCRIPTION 1 D1 SDA I/O D Serial data I/O 2 C1 SCL I D Serial clock. 3 B2 AD1 I D Address input bit 1 4 A1 PINTDAV O D Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low. 5 B1 RESET I D System reset. All register values reset to default values. 6 A2 DGND Digital ground 7 A3 I/OVDD Digital I/O interface voltage B3, B4, No internal connection, but solder bumps are populated. These pins may be connected to analog ground 8, 19 C2, C3, NC for mechanical stability. D2, D3 9 A4 AUX I A Auxiliary channel input 10 A5 AGND Analog ground 11 B5 VREF I A External reference input 12 C5 SNSVDD Power supply for sensor drivers and other analog blocks. 13 D5 X+ I A X+ channel input 14 E5 Y+ I A Y+ channel input 15 D4 SUBGND Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended. 16 E4 X– I A X– channel input 17 E3 Y– I A Y– channel input 18 E2 SNSGND Sensor driver return 20 E1 AD0 I D Address input bit 0 — C4 NC No solder bump for this location. Sensitive area. Avoid trtace beneath. 5 Submit Documentation Feedback |
类似零件编号 - TSC2004IYZKR |
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类似说明 - TSC2004IYZKR |
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