MCP1700

DS21826B-page 4

© 2007 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Power Supply Ripple

Rejection Ratio

PSRR

—

44

—

dB

Thermal Shutdown Protection

—

140

—

°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

-40

+125

°C

Operating Temperature Range

-40

+125

°C

Storage Temperature Range

-65

+150

°C

Thermal Package Resistance

Thermal Resistance, SOT-23

—336

—

°C/W

Minimum Trace Width Single Layer

Board

—

230

—

°C/W

Typical FR4 4-layer Application

Thermal Resistance, SOT-89

—

52

—

°C/W

Typical, 1 square inch of copper

Thermal Resistance, TO-92

—

131.9

—

°C/W

EIA/JEDEC JESD51-751-7

4-Layer Board

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

DC CHARACTERISTICS (CONTINUED)

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

2:

3:

4:

Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

5:

Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

6:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

junction temperatures above 150°C can impact the device reliability.

7:

The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the

ambient temperature is not significant.