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CDR32BX109ABSP 数据表(PDF) 6 Page - Kemet Corporation |
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CDR32BX109ABSP 数据表(HTML) 6 Page - Kemet Corporation |
6 / 10 page ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with EIA standard 481-1: Taping of surface mount components for automatic handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 78 for details on reeling quantities for commercial chips and page 87 for MIL-PRF-55681 chips. CERAMIC CHIP CAPACITORS Packaging Information Tape & Reel Packaging 8mm ±.30 (.315 ±.012") or 12mm ±.30 (.472 ±.012") 178mm (7.00") or 330mm (13.00") Anti-Static Reel Embossed Carrier* 0402 and 0603 case sizes available on punched paper only. Embossment Anti-Static Cover Tape (.10mm (.004") Max Thickness) Chip Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military) * Punched paper carrier used for 0402 and 0603 case size. g handling. This packaging system is compatible with all tape fed automatic pick and place systems. See page 81 for details on reeling quantities for commercial chips and page 90 for MIL-PRF-55681 chips. KEMET ® X C G Z Y Grid placement courtyard Z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 G 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 X 0.74 1.08 1.60 2.00 2.90 3.70 6.90 5.50 6.80 Y(ref) 0.93 1.05 1.30 1.50 1.50 1.80 1.80 1.85 1.85 C(ref) 1.21 1.73 2.00 3.00 3.00 4.10 4.10 5.15 5.15 Z 3.18 3.70 4.90 4.90 G 0.68 0.70 1.50 1.50 X 0.80 1.10 1.40 2.00 Y(ref) 1.25 1.50 1.70 1.70 Smin 1.93 2.20 3.20 3.20 Wave Solder Reflow Solder Calculation Formula Z = Lmin + 2Jt + Tt G = Smax - 2Jh -Th X = Wmin + 2Js + Ts Tt, Th, Ts = Combined tolerances 0402 0603 0805 1206 1210 1812 1825 2220 2225 Dimension Not Recommended Not Recommended C X Grid Placement Courtyard G Y Z SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM 93 |
类似零件编号 - CDR32BX109ABSP |
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类似说明 - CDR32BX109ABSP |
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