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MC33882FC 数据表(PDF) 8 Page - Freescale Semiconductor, Inc

部件名 MC33882FC
功能描述  Six-Output Low-Side Switch with SPI and Parallel Input Control
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MC33882FC 数据表(HTML) 8 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
8
Freescale Semiconductor
33882
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RESISTANCE (11), (12)
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (13)
HSOP
QFN
RθJA
41
85
°C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) (14)
HSOP
QFN
RθJMA
18
27
°C/W
Junction-to-Board (Bottom)
HSOP
QFN
RθJB
3.0
10
°C/W
Junction-to-Case (Top) (15)
HSOP
QFN
RθJC
0.2
1.2
°C/W
Notes
11.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
12.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
13.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
14.
Per JEDEC JESD51-6 with the board horizontal.
15.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC
883, Method 1012.1) with the cold plate temperature used for the case temperature.
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Limit


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