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MCZ33291EGR2 数据表(PDF) 5 Page - Freescale Semiconductor, Inc |
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MCZ33291EGR2 数据表(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 26 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 33291 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Thermal Resistance Junction-to-Ambient (Natural Convection, Single-Layer Board) (12), (13) Junction-to-Ambient (Natural Convection, Four-Layer Board) (12), (14) Junction to Board (15) RθJA RθJMA RθJL 68 44 20 °C/W Notes 12. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 13. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal. 14. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 15. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Table 3. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit |
类似零件编号 - MCZ33291EGR2 |
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类似说明 - MCZ33291EGR2 |
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