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TDA7297 数据表(PDF) 8 Page - STMicroelectronics |
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TDA7297 数据表(HTML) 8 Page - STMicroelectronics |
8 / 11 page TDA7266SA 8/11 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important the dimensioning of the Heat Sinker RTh (°C/W). The parameters that influence the dimensioning are: – Maximum dissipated power for the device (Pdmax) – Max thermal resistance Junction to case (RTh j-c) – Max. ambient temperature Tamb max – Quiescent current Iq (mA) Example: VCC = 11V, Rload = 8ohm, RTh j-c = 2.5 °C/W , Tamb max = 50°C Pdmax = (N° channels) · Pdmax = 2 · ( 3.0 ) + 0.5 = 6.5 W (Heat Sinker) In figure 12 is shown the Power derating curve for the device. Figure 12. Power derating curve V cc 2 Π 2 R loa d 2 -------------- ⋅ --------------------------- I q V cc ⋅ + R Th c-a 150 T am b max – P d max ----------------------------------------- R Th j-c – 150 50 – 6.5 ---------------------- 2.5 – 12.8 °C/W == = a) Infinite Heatsink b) 7 °C/ W c) 10 °C/ W (c) (a) (b) 0 5 10 15 20 25 0 40 80 120 160 Tamb (°C) a) Infinite Heatsink b) 7 °C/ W c) 10 °C/ W (c) (a) (b) 0 5 10 15 20 25 0 40 80 120 160 Tamb (°C) |
类似零件编号 - TDA7297 |
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类似说明 - TDA7297 |
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