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FUJITSU SEMICONDUCTOR

DATA SHEET

SMALL OUTLINE L-LEADED PACKAGE

8 PIN PLASTIC

8-pin plastic SOP

Lead pitch

1.27 mm

Package width

×

package length

5.3

× 6.35 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

2.25 mm MAX

Weight

0.10 g

Code

(Reference)

P-SOP8-5.3

×6.35-1.27

8-pin plastic SOP

(FPT-8P-M01)

(FPT-8P-M01)

C

2002 FUJITSU LIMITED F08002S-c-6-7

Details of "A" part

7.80±0.40

5.30±0.30

(.209±.012) (.307±.016)

+.010

–0.20

+0.25

6.35

INDEX

1.27(.050)

0.10(.004)

14

5

8

0.47±0.08

(.019±.003)

–0.04

+0.03

0.17

.007

+.001

–.002

"A"

0.25(.010)

(Stand off)

0~8˚

(Mounting height)

2.00

+0.25

–0.15

.079

+.010

–.006

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.10

+0.10

–0.05

–.002

+.004

.004

0.10(.004)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

FPT-8P-M01

0212

Note 1) *1 : These dimensions include resin protrusion.

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3) Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.