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L6402MH10RI 数据表(PDF) 5 Page - Advanced Micro Devices

部件名 L6402MH10RI
功能描述  128 Megabit (4 M x 32-Bit/8 M x 16-Bit) MirrorBit??3.0 Volt-only Uniform Sector Flash Memory with Versatile I/O??Control
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制造商  AMD [Advanced Micro Devices]
网页  http://www.amd.com
标志 AMD - Advanced Micro Devices

L6402MH10RI 数据表(HTML) 5 Page - Advanced Micro Devices

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January 23, 2006
Am29LV6402M
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
MCP Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . 4
Flash Memory Block diagram . . . . . . . . . . . . . . . . 5
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 6
Special Package Handling Instructions .................................... 6
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
x16 Mode .................................................................................. 7
x32 Mode .................................................................................. 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Device Bus Operations ....................................................... 9
VersatileIO
TM (V
IO) Control ........................................................ 9
Requirements for Reading Array Data ................................... 10
Page Mode Read ............................................................................10
Writing Commands/Command Sequences ............................ 10
Write Buffer .....................................................................................10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Automatic Sleep Mode ........................................................... 11
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 11
Table 2. Sector Address Table........................................................ 12
Table 3. Autoselect Codes, (High Voltage Method) ....................... 15
Sector Group Protection and Unprotection ............................. 16
Table 4. Sector Group Protection/Unprotection Address Table ..... 16
Temporary Sector Group Unprotect ....................................... 17
Figure 1. Temporary Sector Group Unprotect Operation ................17
Figure 2. In-System Sector Group Protect/Unprotect Algorithms ...18
SecSi (Secured Silicon) Sector Flash Memory Region .......... 19
Table 5. SecSi Sector Contents ...................................................... 19
Figure 3. SecSi Sector Protect Verify ..............................................20
Hardware Data Protection ...................................................... 20
Low VCC Write Inhibit .....................................................................20
Write Pulse “Glitch” Protection ........................................................20
Logical Inhibit ..................................................................................20
Power-Up Write Inhibit ....................................................................20
Common Flash Memory Interface (CFI) . . . . . . . 20
Table 6. CFI Query Identification String ..........................................21
Table 7. System Interface String..................................................... 21
Table 8. Device Geometry Definition ..............................................22
Table 9. Primary Vendor-Specific Extended Query ........................23
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................ 24
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 25
Doubleword/Word Program Command Sequence ................. 25
Unlock Bypass Command Sequence ..............................................25
Write Buffer Programming ...............................................................25
Accelerated Program ......................................................................26
Figure 4. Write Buffer Programming Operation ...............................27
Figure 5. Program Operation ..........................................................28
Program Suspend/Program Resume Command Sequence ... 28
Figure 6. Program Suspend/Program Resume ...............................28
Chip Erase Command Sequence ........................................... 29
Sector Erase Command Sequence ........................................ 29
Erase Suspend/Erase Resume Commands ........................... 29
Figure 7. Erase Operation .............................................................. 30
Table 10. Command Definitions (x32 Mode, WORD# = VIH) ......... 31
Table 11. Command Definitions (x16 Mode, WORD# = V
IL).......... 32
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 33
DQ7 and DQ5: Data# Polling .................................................. 33
Figure 8. Data# Polling Algorithm .................................................. 33
DQ6 and DQ14: Toggle Bits I ................................................. 34
Figure 9. Toggle Bit Algorithm ........................................................ 35
DQ2 and DQ10: Toggle Bits II ................................................ 35
Reading Toggle Bits DQ6 and DQ14/DQ2 and DQ10 ............ 35
DQ5 and DQ13: Exceeded Timing Limits ............................... 36
DQ3 and DQ11: Sector Erase Timer ...................................... 36
DQ1: Write-to-Buffer Abort ..................................................... 37
Table 12. Write Operation Status................................................... 37
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 38
Figure 10. Maximum Negative Overshoot Waveform ................... 38
Figure 11. Maximum Positive Overshoot Waveform ..................... 38
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 38
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 12. Test Setup ..................................................................... 40
Table 13. Test Specifications ......................................................... 40
Key to Switching Waveforms. . . . . . . . . . . . . . . . 40
Figure 13. Input Waveforms and
Measurement Levels ...................................................................... 40
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 41
Read-Only Operations ........................................................... 41
Figure 14. Read Operation Timings ............................................... 41
Figure 15. Page Read Timings ...................................................... 42
Hardware Reset (RESET#) .................................................... 43
Figure 16. Reset Timings ............................................................... 43
Erase and Program Operations .............................................. 44
Figure 17. Program Operation Timings .......................................... 45
Figure 18. Accelerated Program Timing Diagram .......................... 45
Figure 19. Chip/Sector Erase Operation Timings .......................... 46
Figure 20. Data# Polling Timings (During Embedded Algorithms) . 47
Figure 21. Toggle Bit Timings (During Embedded Algorithms) ...... 48
Figure 22. DQ2 vs. DQ6 ................................................................. 48
Temporary Sector Unprotect .................................................. 49
Figure 23. Temporary Sector Group Unprotect Timing Diagram ... 49
Figure 24. Sector Group Protect and Unprotect Timing Diagram .. 50
Alternate CE# Controlled Erase and Program Operations ..... 51
Figure 25. Alternate CE# Controlled Write (Erase/Program)
Operation Timings .......................................................................... 52
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 52
Erase And Programming Performance. . . . . . . . 53
TSOP Pin and BGA Package Capacitance . . . . . 53
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
LSB080—80-Ball Fortified Ball Grid Array (Fortified BGA)
13 x 11 mm Package .............................................................. 54
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55


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