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AM29DS320GB70EIN 数据表(PDF) 4 Page - SPANSION |
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AM29DS320GB70EIN 数据表(HTML) 4 Page - SPANSION |
4 / 54 page January 27, 2003 Am29DS320G 3 AD VA NCE I N FO RM ATI O N TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Package Handling Instructions .......................................... 5 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 8 Table 1. Device Bus Operations .............................................................8 Word/Byte Configuration ................................................................ 8 Requirements for Reading Array Data ...........................................8 Writing Commands/Command Sequences .................................... 9 Accelerated Program Operation .....................................................9 Autoselect Functions ...................................................................... 9 Simultaneous Read/Write Operations with Zero Latency ...........................................................................9 Standby Mode ................................................................................ 9 Automatic Sleep Mode ...................................................................9 RESET#: Hardware Reset Pin .....................................................10 Output Disable Mode ...................................................................10 Table 2. Top Boot Sector Addresses ...................................................11 Table 3. Top Boot SecSi TM Sector Addresses ..................................... 12 Table 4. Bottom Boot Sector Addresses ...............................................13 Table 5. Bottom Boot SecSiTM Sector Addresses ................................ 14 Autoselect Mode .......................................................................... 15 Table 6. Autoselect Codes, (High Voltage Method) .............................15 Sector/Sector Block Protection and Unprotection ........................ 16 Table 7. Top Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................16 Table 8. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................16 Write Protect (WP#) .....................................................................17 Temporary Sector Unprotect ........................................................ 17 Figure 1. Temporary Sector Unprotect Operation ................................. 17 Figure 2. In-System Sector Protection/ Sector Unprotection Algorithms ............................................................ 18 SecSi TM (Secured Silicon) Sector Flash Memory Region .................................................................. 19 Factory Locked: SecSi Sector Programmed and Protected At the Factory .........................................................................................19 Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory ...................................................................................19 Figure 3. SecSi Sector Protect Verify.................................................... 20 Hardware Data Protection ............................................................ 20 Low VCC Write Inhibit .................................................................. 20 Write Pulse “Glitch” Protection .....................................................20 Logical Inhibit ...............................................................................20 Power-Up Write Inhibit .................................................................20 Common Flash Memory Interface (CFI) . . . . . . . 21 Table 9. CFI Query Identification String ................................................ 21 Table 10. System Interface String......................................................... 22 Table 11. Device Geometry Definition .................................................. 22 Table 12. Primary Vendor-Specific Extended Query ............................ 23 Command Definitions . . . . . . . . . . . . . . . . . . . . . . 23 Reading Array Data ...................................................................... 23 Reset Command .......................................................................... 24 Autoselect Command Sequence .................................................. 24 Enter SecSiTM Sector/Exit SecSi Sector Command Sequence ...................................................................24 Byte/Word Program Command Sequence ...................................24 Unlock Bypass Command Sequence ........................................... 25 Figure 4. Program Operation ................................................................ 25 Chip Erase Command Sequence ................................................. 25 Sector Erase Command Sequence .............................................. 26 Erase Suspend/Erase Resume Commands ................................ 26 Figure 5. Erase Operation .................................................................... 27 Table 13. Command Definitions ........................................................... 28 Write Operation Status . . . . . . . . . . . . . . . . . . . . 29 DQ7: Data# Polling ...................................................................... 29 Figure 6. Data# Polling Algorithm ......................................................... 29 RY/BY#: Ready/Busy# ................................................................. 30 DQ6: Toggle Bit I .......................................................................... 30 Figure 7. Toggle Bit Algorithm .............................................................. 30 DQ2: Toggle Bit II ......................................................................... 31 Reading Toggle Bits DQ6/DQ2 .................................................... 31 DQ5: Exceeded Timing Limits ...................................................... 31 DQ3: Sector Erase Timer ............................................................. 31 Table 14. Write Operation Status ......................................................... 32 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33 Figure 8. Maximum Negative Overshoot Waveform ............................. 33 Figure 9. Maximum Positive Overshoot Waveform .............................. 33 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 10. ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents).................................................................... 35 Figure 11. Typical ICC1 vs. Frequency................................................... 35 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 12. Test Setup .......................................................................... 36 Figure 13. Input Waveforms and Measurement Levels ........................ 36 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 14. Read Operation Timings...................................................... 37 Figure 15. Reset Timings...................................................................... 38 Word/Byte Configuration (BYTE#) ............................................... 39 Figure 16. BYTE# Timings for Read Operations .................................. 39 Figure 17. BYTE# Timings for Write Operations .................................. 39 Erase and Program Operations ................................................... 40 Figure 18. Program Operation Timings ................................................ 41 Figure 19. Accelerated Program Timing Diagram ................................ 41 Figure 20. Chip/Sector Erase Operation Timings ................................. 42 Figure 21. Back-to-back Read/Write Cycle Timings ............................. 43 Figure 22. Data# Polling Timings (During Embedded Algorithms) ....... 43 Figure 23. Toggle Bit Timings (During Embedded Algorithms) ............ 44 Figure 24. DQ2 vs. DQ6 ....................................................................... 44 Temporary Sector Unprotect ........................................................ 45 Figure 25. Temporary Sector Unprotect Timing Diagram ..................... 45 Figure 26. Sector/Sector Block Protect and Unprotect Timing Diagram 46 Alternate CE# Controlled Erase and Program Operations ........... 47 Figure 27. Alternate CE# Controlled Write (Erase/Program) Operation Timings ................................................................................ 48 Erase And Programming Performance . . . . . . . 49 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49 TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 49 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50 FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ......................... 50 TS 048—Thin Small Outline Package .......................................... 51 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52 Revision A (May 14, 2002) ........................................................... 52 Revision A+1 (January 3, 2003) ................................................... 52 |
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