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AD7533JN 数据表(PDF) 7 Page - Intersil Corporation |
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AD7533JN 数据表(HTML) 7 Page - Intersil Corporation |
7 / 8 page 7 Die Characteristics DIE DIMENSIONS 101 mils x 103 mils (2565 µm x 2616µm) METALLIZATION Type: Pure Aluminum Thickness: 10 ±1kÅ PASSIVATION Type: PSG/Nitride PSG: 7 ±1.4kÅ Nitride: 8 ±1.2kÅ PROCESS CMOS Metal Gate Metallization Mask Layout AD7533 PIN 3 GND PIN 2 IOUT2 PIN 1 IOUT1 PIN 16 RFEEDBACK PIN 15 VREF PIN 14 V+ NC NC NC NC PIN 4 BIT 1 (MSB) PIN 5 BIT 2 PIN 6 BIT 3 PIN 7 BIT 4 PIN 11 BIT 8 (LSB) PIN 10 BIT 7 PIN 9 BIT 6 PIN 8 BIT 5 (PIN 12, BIT 9, AD7533) (PIN 13, BIT 10, AD7533) AD7533 |
类似零件编号 - AD7533JN |
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类似说明 - AD7533JN |
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