MC74HCT74A

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6

PACKAGE DIMENSIONS

SOIC−14

CASE 751A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

G

14

8

7

1

M

0.25 (0.010)

S

B

M

0.25 (0.010)

T

−T−

F

SEATING

PLANE

K

C

J

M

_

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

8.55

8.75

0.337

0.344

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27 BSC

0.050 BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0

7

0

7

P

5.80

6.20

0.228

0.244

R

0.25

0.50

0.010

0.019

__

__

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

7X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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