MC10EP451, MC100EP451

http://onsemi.com

10

PACKAGE DIMENSIONS

QFN32 5*5*1 0.5 P

CASE 488AM−01

ISSUE O

SEATING

32 X

K

0.15 C

(A3)

A

A1

D2

b

1

9

16

17

32

2 X

2 X

E2

32 X

8

24

32 X

L

32 X

BOTTOM VIEW

EXPOSED PAD

TOP VIEW

SIDE VIEW

D

A

B

E

0.15 C

PIN ONE

LOCATION

0.10 C

0.08 C

C

25

e

A

0.10

B

C

0.05 C

NOTES:

1. DIMENSIONS AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM TERMINAL

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

PLANE

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.800

0.900

1.000

A1

0.000

0.025

0.050

A3

0.200 REF

b

0.180

0.250

0.300

D

5.00 BSC

D2

2.950

3.100

3.250

E

5.00 BSC

E2

e

0.500 BSC

K

0.200

−−−

−−−

L

0.300

0.400

0.500

2.950

3.100

3.250

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50 PITCH

3.20

0.28

3.20

32 X

28 X

0.63

32 X

5.30

5.30

ON Semiconductor and

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MC10EP451/D

ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).

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