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MC100ELT25 数据表(PDF) 2 Page - ON Semiconductor

部件名 MC100ELT25
功能描述  ?? V Differential ECL to TTL Translator
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

MC100ELT25 数据表(HTML) 2 Page - ON Semiconductor

  MC100ELT25 Datasheet HTML 1Page - ON Semiconductor MC100ELT25 Datasheet HTML 2Page - ON Semiconductor MC100ELT25 Datasheet HTML 3Page - ON Semiconductor MC100ELT25 Datasheet HTML 4Page - ON Semiconductor MC100ELT25 Datasheet HTML 5Page - ON Semiconductor MC100ELT25 Datasheet HTML 6Page - ON Semiconductor MC100ELT25 Datasheet HTML 7Page - ON Semiconductor MC100ELT25 Datasheet HTML 8Page - ON Semiconductor  
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MC10ELT25, MC100ELT25
http://onsemi.com
2
Figure 1. 8−Lead Pinout (Top View) and Logic
Diagram
1
2
3
45
6
7
8
Q
GND
VCC
D
NC
D
VBB
VEE
ECL
TTL
Table 1. PIN DESCRIPTION
Pin
Function
D, D
ECL Differential Inputs
Q
TTL Output
VBB
Reference Voltage Output
VCC
Positive Supply
VEE
Negative Supply
GND
Ground
NC
No Connect
EP
Exposed pad must be connected to a sufficient
thermal conduit. Electrically connect to the most
negative supply or leave floating open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
> 1 kV
> 400 V
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC−8
TSSOP−8
DFN8
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
38 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
GND = 0 V
VEE = −5.0 V
7
V
VEE
Negative Power Supply
GND = 0 V
VCC = +5.0 V
−8
V
VIN
Input Voltage
GND = 0 V
0 to VEE
V
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SOIC−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44 ± 5%
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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