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MBT35200MT1_05 Datasheet(数据表) 5 Page - ON Semiconductor |
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MBT35200MT1 Datasheet(HTML) 5 Page - ON Semiconductor |
5 page ![]() MBT35200MT1 http://onsemi.com 5 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE P 23 4 5 6 D 1 e b E A1 A 0.05 (0.002) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. c L HE DIM A MIN NOM MAX MIN MILLIMETERS 0.90 1.00 1.10 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.25 0.38 0.50 0.010 c 0.10 0.18 0.26 0.004 D 2.90 3.00 3.10 0.114 E 1.30 1.50 1.70 0.051 e 0.85 0.95 1.05 0.034 L 0.20 0.40 0.60 0.008 0.039 0.043 0.002 0.004 0.014 0.020 0.007 0.010 0.118 0.122 0.059 0.067 0.037 0.041 0.016 0.024 NOM MAX 2.50 2.75 3.00 0.099 0.108 0.118 H E − − 0 ° 10 ° 0 ° 10 ° q q 0.95 0.037 1.9 0.075 0.95 0.037 mm inches SCALE 10:1 1.0 0.039 2.4 0.094 0.7 0.028 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* STYLE 6: PIN 1. COLLECTOR 2. COLLECTOR 3. BASE 4. EMITTER 5. COLLECTOR 6. COLLECTOR |