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TL1454ACDBR 数据表(PDF) 3 Page - Texas Instruments |
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TL1454ACDBR 数据表(HTML) 3 Page - Texas Instruments |
3 / 27 page TL1454A, TL1454AY DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM) CONTROL CIRCUIT SLVS423 A– MAY 2002 – REVISED SEPTEMBER 2002 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL1454AY chip information This device, when properly assembled, displays characteristics similar to the TL1454AC. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. TL1454AY (2) (14) (1) (3) (4) (5) (6) (7) (8) (16) (13) (12) (11) (10) (9) REF DTC2 IN2+ IN2 – COMP2 VCC OUT2 OUT1 COMP1 IN1– IN1 + RT CT GND 86 108 (1) (2) (3) (4) (5) (6) (7) (10) (11) (12) (13) (14) (15) (16) (8) (9) (15) SCP DTC1 |
类似零件编号 - TL1454ACDBR |
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类似说明 - TL1454ACDBR |
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