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HSMX-C260 数据表(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HSMX-C260 数据表(HTML) 2 Page - Agilent(Hewlett-Packard) |
2 / 8 page 2 Package Dimensions Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. Absolute Maximum Ratings at TA=25°C Parameter HSMx-C260 Units DC Forward Current[1] 25 mA Peak Pulsing Current[2] 100 mA Power Dissipation 65 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range -25 to +80 °C Storage Temperature Range -30 to +85 °C Soldering Temperature See IR soldering profile (Figure 6) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25 °C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. HSMx-C260 3.4 (0.134) 0.3 (0.012) 0.50 ± 0.15 (0.020 ± 0.006) 1.1 (0.043) POLARITY CATHODE MARK 1.1 (0.043) 0.50 ± 0.15 (0.020 ± 0.006) 1.2 (0.047) 1.25 (0.049) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL |
类似零件编号 - HSMX-C260 |
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类似说明 - HSMX-C260 |
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