数据搜索系统,热门电子元器件搜索
  Chinese▼

Delete All
ON OFF
ALLDATASHEETCN.COM

X  

预览 PDF Download HTML

34653 Datasheet(数据表) 4 Page - Freescale Semiconductor, Inc

部件型号  34653
说明  1.0 A Negative Voltage Hot Swap Controller
下载  24 Pages
Scroll/Zoom Zoom In 100% Zoom Out
制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 

34653 Datasheet(HTML) 4 Page - Freescale Semiconductor, Inc

 
Zoom Inzoom in Zoom Outzoom out
 4 page
background image
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
34653
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
VPWR
85
V
Power MOSFET Energy Capability
EMOSFET
Varies (1)
mJ
Continuous Output Current (2)
IO(CONT)
1.0
A
Maximum Voltage
DISABLE Pin
ILIM and ICHG Pins
PG Pin (VPG - VIN)
PG
Pin (VPG - VIN)
VIN - 0.3 to VPWR + 5.5
5.0
85
85
V
All Pins Minimum Voltage
-0.3
V
PG, PG Maximum Current
Internally Limited
A
ESD Voltage, All Pins (3)
Human Body Model
Machine Model
VESD3
VESD4
±2000
±200
V
THERMAL RATINGS
Storage Temperature
TSTG
-65 to 150
°C
Operating Temperature
Ambient (4)
Junction
TA
TJ
-40 to 85
-40 to 160
°C
Peak Package Reflow Temperature During Reflow (5), (6)
TPPRT
Note 6
°C
Thermal Resistance (7)
, (8)
Junction-to-Ambient, Single-Layer Board (9)
Junction-to-Ambient, Four-Layer Board (10)
RθJA
RθJMA
167
115
°C/W
Notes
1.
Refer to the section titled Power MOSFET Energy Capability on page 21 for a detailed explanation on this parameter.
2.
Continuous output current capability so long as TJ is ≤ 160°C.
3.
ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω).
4.
The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
7.
Refer to the section titled Thermal Shutdown on page 15 for more thermal resistance values under various conditions.
8.
The VOUT and VIN pins comprise the main heat conduction paths.
9.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
10.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.




HTML 页

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24 


数据表 下载




链接网址


Privacy Policy
ALLDATASHEETCN.COM
ALLDATASHEET是否为您带来帮助?  [ DONATE ]  

关于 Alldatasheet    |   广告服务   |   联系我们   |   隐私政策   |   书签   |   链接交换   |   制造商名单
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl