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DL126TRS 数据表(PDF) 6 Page - ON Semiconductor

部件名 DL126TRS
功能描述  Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes
Download  8 Pages
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

DL126TRS 数据表(HTML) 6 Page - ON Semiconductor

  DL126TRS Datasheet HTML 1Page - ON Semiconductor DL126TRS Datasheet HTML 2Page - ON Semiconductor DL126TRS Datasheet HTML 3Page - ON Semiconductor DL126TRS Datasheet HTML 4Page - ON Semiconductor DL126TRS Datasheet HTML 5Page - ON Semiconductor DL126TRS Datasheet HTML 6Page - ON Semiconductor DL126TRS Datasheet HTML 7Page - ON Semiconductor DL126TRS Datasheet HTML 8Page - ON Semiconductor  
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DL126TRS/D
http://onsemi.com
6
Dimensions for Device Positioning on Tape for Fan Fold Box
Symbol
Specification
Item
Symbol
Millimeter
Inches
Item
Symbol
Max
Min
Max
Min
Item
T1
Overall Taped Package Thickness
0.0567
1.44
T2
Carrier Strip Thickness
0.014
0.027
0.35
0.65
W
Carrier Strip Width
0.6889
0.7481
17.5
19
W1
Adhesive Tape Width
0.2165
0.2841
5.5
6.3
W2
Adhesive Tape Position
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements established in Figures 5, 6 and 7.
4. Maximum non–cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
252 mm
9.92”
58 mm
2.28”
MAX
MAX
13”
MAX
330 mm
Figure 9. Fan Fold Box Dimensions
ARBOR HOLE DIA.
30.5mm ± 0.25mm
MARKING NOTE
RECESS DEPTH
9.5mm MIN
48 mm
MAX
CORE DIA.
82mm ± 1mm
HUB RECESS
76.2mm ± 1mm
365mm + 3, - 0mm
38.1mm ± 1mm
Material used must not cause deterioration of components or degrade lead
solderability
Figure 10. Reel Dimensions
100 GRAM
PULL FORCE
16 mm
HOLDING
FIXTURE
HOLDING
FIXTURE
HOLDING
FIXTURE
16 mm
70 GRAM
PULL FORCE
500 GRAM PULL FORCE
The component shall not pull free with
a 300 gram load applied to the leads for
3
± 1 second.
The component shall not pull free with
a 70 gram load applied to the leads for
3
± 1 second.
There shall be no deviation in the
leads and no component leads
shall be pulled free of the tape with
a 500 gram load applied to the
component body for 3
± 1 second.
Figure 11. Test #1
Figure 12. Test #2
Figure 13. Test #3
ADHESION PULL TESTS


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