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IRF6643TRPBF Datasheet(数据表) 3 Page - International Rectifier

部件型号  IRF6643TRPBF
说明  DirectFET Power MOSFET - Typical value (unless otherwise specified)
下载  9 Pages
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制造商  IRF [International Rectifier]
网页  http://www.irf.com
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IRF6643TRPBF Datasheet(HTML) 3 Page - International Rectifier

   
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IRF6643TRPbF
www.irf.com
3
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

ƒ Surface mounted on 1 in. square Cu board, steady state.
„ TC measured with thermocouple incontact with top (Drain) of part.
ˆ Used double sided cooling, mounting pad with large heatsink.
Notes:
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Š Rθ is measured at TJ of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
board (still air).
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
1E-006
1E-005
0.0001
0.001
0.01
0.1
1
10
100
t1 , Rectangular Pulse Duration (sec)
0.01
0.1
1
10
100
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = Pdm x Zthja + Ta
τ
J
τ
J
τ
1
τ
1
τ
2
τ
2
τ
3
τ
3
R
1
R
1
R
2
R
2
R
3
R
3
Ci
i
/Ri
Ci=
τi/Ri
τ
τ
C
τ
4
τ
4
R
4
R
4
Ri (°C/W)
τi (sec)
0.6784
0.00086
17.299
0.57756
17.566
8.94
9.4701
106
A
Absolute Maximum Ratings
Parameter
Units
PD @TA = 25°C
Power Dissipation
e
W
PD @TA = 70°C
Power Dissipation
e
PD @TC = 25°C
Power Dissipation
f
TP
Peak Soldering Temperature
°C
TJ
Operating Junction and
TSTG
Storage Temperature Range
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJA
Junction-to-Ambient
el
–––
45
RθJA
Junction-to-Ambient
jl
12.5
–––
RθJA
Junction-to-Ambient
kl
20
–––
°C/W
RθJC
Junction-to-Case
fl
–––
1.4
RθJ-PCB
Junction-to-PCB Mounted
1.0
–––
2.8
1.8
270
-40 to + 150
Max.
89




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