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S29GL128N90TFIV10 数据表(PDF) 89 Page - SPANSION |
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S29GL128N90TFIV10 数据表(HTML) 89 Page - SPANSION |
89 / 100 page S29GL-N_00_B3 October 13, 2006 S29GL-N MirrorBit™ Flash Family 87 Data Sheet Erase And Programming Performance Notes: 1. Typical program and erase times assume the following conditions: 25°C, 3.0 V VCC, 10,000 cycles, checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 3.0 V, 100,000 cycles. 3. Effective write buffer specification is based upon a 16-word write buffer operation. 4. The typical chip programming time is considerably less than the maximum chip programming time listed, since most words program faster than the maximum program times listed. 5. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure. 6. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 12 on page 63 and Table 14 on page 65 for further information on command definitions. TSOP Pin and BGA Package Capacitance Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0 MHz. Parameter Typ (Note 1) Max (Note 2) Unit Comments Sector Erase Time 0.5 3.5 sec Excludes 00h programming prior to erasure (Note 5) Chip Erase Time S29GL128N 64 256 sec S29GL256N 128 512 S29GL512N 256 1024 Total Write Buffer Programming Time (Note 3) 240 µs Excludes system level overhead (Note 6) Total Accelerated Effective Write Buffer Programming Time (Note 3) 200 µs Chip Program Time (Note 4) S29GL128N 123 sec S29GL256N 246 S29GL512N 492 Parameter Symbol Parameter Description Test Setup Typ Max Unit CIN Input Capacitance VIN = 0 TSOP 6 7.5 pF BGA 4.2 5.0 pF COUT Output Capacitance VOUT = 0 TSOP 8.5 12 pF BGA 5.4 6.5 pF CIN2 Control Pin Capacitance VIN = 0 TSOP 7.5 9 pF BGA 3.9 4.7 pF |
类似零件编号 - S29GL128N90TFIV10 |
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类似说明 - S29GL128N90TFIV10 |
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