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CY7C1353G 数据表(PDF) 3 Page - Cypress Semiconductor

部件名 CY7C1353G
功能描述  4-Mbit (256K x 18) Flow-through SRAM with NoBL™ Architecture
Download  13 Pages
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制造商  CYPRESS [Cypress Semiconductor]
网页  http://www.cypress.com
标志 CYPRESS - Cypress Semiconductor

CY7C1353G 数据表(HTML) 3 Page - Cypress Semiconductor

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PRELIMINARY
CY7C1353G
Document #: 38-05515 Rev. *A
Page 3 of 13
Pin Definitions (100-pin TQFP Package)
Name
I/O
Description
A0, A1, A
Input-
Synchronous
Address Inputs used to select one of the 256K address locations. Sampled at the rising edge
of the CLK. A[1:0] are fed to the two-bit burst counter.
BW[A:B]
Input-
Synchronous
Byte Write Inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on the
rising edge of CLK.
WE
Input-
Synchronous
Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
signal must be asserted LOW to initiate a write sequence.
ADV/LD
Input-
Synchronous
Advance/Load Input. Used to advance the on-chip address counter or load a new address. When
HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new address
can be loaded into the device for an access. After being deselected, ADV/LD should be driven LOW
in order to load a new address.
CLK
Input-Clock
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK
is only recognized if CEN is active LOW.
CE1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE2, and CE3 to select/deselect the device.
CE2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE1 and CE3 to select/deselect the device.
CE3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE1 and CE2 to select/deselect the device.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Combined with the synchronous logic block
inside the device to control the direction of the I/O pins. When LOW, the I/O pins are allowed to
behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE
is masked during the data portion of a write sequence, during the first clock when emerging from a
deselected state, when the device has been deselected.
CEN
Input-
Synchronous
Clock Enable Input, active LOW. When asserted LOW the Clock signal is recognized by the SRAM.
When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not deselect the
device, CEN can be used to extend the previous cycle when required.
ZZ
Input-
Asynchronous
ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition
with data integrity preserved. During normal operation, this pin can be connected to Vss or left
floating.
DQs
I/O-
Synchronous
Bidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered by
the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by address during the clock rise of the read cycle. The direction of the pins is controlled by OE and
the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When HIGH,
DQs and DQP[A:B] are placed in a tri-state condition. The outputs are automatically tri-stated during
the data portion of a write sequence, during the first clock when emerging from a deselected state,
and when the device is deselected, regardless of the state of OE.
DQP[A:B]
I/O-
Synchronous
Bidirectional Data Parity I/O Lines. Functionally, these signals are identical to DQs. During write
sequences, DQP[A:B] is controlled by BWx correspondingly.
MODE
Input
Strap Pin
MODE Input. Selects the burst order of the device.
When tied to Gnd selects linear burst sequence. When tied to VDD or left floating selects interleaved
burst sequence.
VDD
Power Supply Power supply inputs to the core of the device.
VDDQ
I/O Power
Supply
Power supply for the I/O circuitry.
VSS
Ground
Ground for the device.
NC
No Connects. Not Internally connected to the die.
9M,18M,36M and 72M are address expansion pins and are not internally connected to the die.


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