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HLMP-KB45-A0000 数据表(PDF) 4 Page - Agilent(Hewlett-Packard) |
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HLMP-KB45-A0000 数据表(HTML) 4 Page - Agilent(Hewlett-Packard) |
4 / 6 page 4 Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chlorinated hydrocarbon family (methylene chloride, trichloroethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts. For information on soldering LEDs, please refer to Application Note 1027. Figure 8. Relative Luminous Intensity vs. Angular Displacement for HLMP-KB45. Figure 7. Relative Luminous Intensity vs. Angular Displacement for HLMP-DB25. 10° 100° 40° 70° 20° 60° 80° 30° 50° 90° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° .6 .8 .2 .4 1.0 10° 100° 40° 70° 20° 60° 80° 30° 50° 90° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° .6 .8 .2 .4 1.0 Figure 6. Maximum DC Forward Current vs. Ambient Temperature. Derating Based on TJ Max. = 115 °C. Figure 5. Relative Luminous Intensity vs. Forward Current. Figure 4. Forward Current vs. Forward Voltage. 1.00E-06 1.00E-02 10 1 PULSE WIDTH (SECONDS) 1.00E-03 1.00E-04 1.00E-05 0 1.2 0.4 IF – DC FORWARD CURRENT – mA 010 20 35 0.8 515 25 30 0.3 0.2 0.1 0.5 0.6 0.7 0.9 1.0 1.1 0 0 TA – AMBIENT TEMPERATURE – °C 30 70 35 20 10 10 50 30 80 5 15 25 20 40 60 90 |
类似零件编号 - HLMP-KB45-A0000 |
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类似说明 - HLMP-KB45-A0000 |
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