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SMF02 数据表(PDF) 6 Page - List of Unclassifed Manufacturers

部件名 SMF02
功能描述  Stand-up miniature power resistors
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制造商  ETC1 [List of Unclassifed Manufacturers]
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标志 ETC1 - List of Unclassifed Manufacturers

SMF02 数据表(HTML) 6 Page - List of Unclassifed Manufacturers

  SMF02 Datasheet HTML 1Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 2Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 3Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 4Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 5Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 6Page - List of Unclassifed Manufacturers SMF02 Datasheet HTML 7Page - List of Unclassifed Manufacturers  
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2001 Mar 15
6
BCcomponents
Product specification
Stand-up miniature power resistors
SMW02/03/05
SMF02/03/05
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
schedule of “IEC publications 60115-1 and 60115-4”,
category 40/200/56 (rated temperature range
−40 °Cto
+200
°C; damp heat, long term, 56 days). The testing also
covers the requirements specified by EIA and EIAJ.
The tests are carried out in accordance with IEC publication
60068, “Recommended basic climatic and mechanical
robustness testing procedure for electronic components”
and under standard atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
In Table 4 the tests and requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-1, 60115-4 and 68”; a short
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Table 4
Test procedures and requirements
IEC
60115-1
CLAUSE
IEC
60068
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-1
4.15
robustness of
resistor body
load 200
±10 N
no visible damage
∆R/R max.: ±0.5% + 0.05 Ω
4.16
U
robustness of
terminations:
Ua
tensile all samples
load 10 N; 10 s
no visible damage
∆R/R max.: ±0.5% + 0.05 Ω
4.17
Ta
solderability
2 s; 235
°C
good tinning; no damage
4.18
Tb
resistance to soldering
heat
thermal shock: 3 s; 350
°C;
2.5 mm from body
∆R/R max.: ±0.5% + 0.05 Ω
4.19
14 (Na)
rapid change of
temperature
30 minutes at
−40 °C and
30 minutes at +200
°C; 5 cycles
no visible damage
∆R/R max.: ±1% + 0.05 Ω
4.22
Fc
vibration
frequency 10 to 500 Hz; displacement
0.75 mm or acceleration 10 g;
3 directions; total 6 hours (3
× 2 hours)
no damage
∆R/R max.: ±0.5% + 0.05 Ω
4.20
Eb
bump
4000
±10 bumps; 390 m/s2
no damage
∆R/R max.: ±0.5% + 0.05 Ω
4.23
climatic sequence:
4.23.2
Ba
dry heat
16 hours; 200
°C
4.23.3
Db
damp heat
(accelerated)
1st cycle
24 hours; 55
°C; 95 to 100% RH
4.23.4
Aa
cold
2 hours;
−40 °C
4.23.5
M
low air pressure
1 hour; 8.5 kPa; 15 to 35
°C
4.23.6
Db
damp heat
(accelerated)
remaining cycles
5days; 55
°C; 95 to 100% RH
∆R/R max.: ±3% + 0.05 Ω


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