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FMM5829X 数据表(PDF) 11 Page - Eudyna Devices Inc |
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FMM5829X 数据表(HTML) 11 Page - Eudyna Devices Inc |
11 / 14 page 11 K-Band Power Amplifier MMIC FMM5829X ■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 0 4025 240 1405 0 0 120 2235 1290 2235 120 3430 0 4025 120 3905 RF-IN RF-OUT VGG1 (VGG3) VDD1 VDD2 VDD3 VDD5 Chip Size : 4025± ± ± ±30um x 2235± ± ± ±30um Chip Thickness : 60± ± ± ±20um Bonding Pad Size : RF-Pad : 120um x 80um VGG-Pad : 80um x 80um VDD-Pad : 100um x 100um Note Note Note Note : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2~6). 450 3430 195 800 1840 1840 3905 195 2115 2100 2040 VDD4 VDD6 (VGG4) (VGG5) (VGG6) 1170 1170 2990 2990 830 (VGG2) |
类似零件编号 - FMM5829X |
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类似说明 - FMM5829X |
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