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TL431XA3 数据表(PDF) 5 Page - Cystech Electonics Corp. |
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TL431XA3 数据表(HTML) 5 Page - Cystech Electonics Corp. |
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5 / 6 page  CYStech Electronics Corp. Spec. No. : C502A3 Issued Date : 2003.03.26 Revised Date : 2005.06.29 Page No. : 5/6 TL431A3 CYStek Product Specification TO-92 Taping Outline Millimeters DIM Item Min. Max. A Component body height 4.33 4.83 D Tape Feed Diameter 3.80 4.20 D1 Lead Diameter 0.36 0.53 D2 Component Body Diameter 4.33 4.83 F1,F2 Component Lead Pitch 2.40 2.90 F1,F2 F1-F2 - ±0.3 H Height Of Seating Plane 15.50 16.50 H1 Feed Hole Location 8.50 9.50 H2 Front To Rear Deflection - 1 H2A Deflection Left Or Right - 1 H3 Component Height - 27 H4 Feed Hole To Bottom Of Component - 21 L Lead Length After Component Removal - 11 L1 Lead Wire Enclosure 2.50 - P Feed Hole Pitch 12.50 12.90 P1 Center Of Seating Plane Location 5.95 6.75 P2 4 Feed Hole Pitch 50.30 51.30 T Over All Tape Thickness - 0.55 T1 Total Taped Package Thickness - 1.42 T2 Carrier Tape Thickness 0.36 0.68 W Tape Width 17.50 19.00 W1 Adhesive Tape Width 5.00 7.00 - 20 pcs Pitch 253 255 H2A H2A H2 H2 D2 A H W W1 H3 H4 H1 L1 L P2 P P1 F1F2 D1 D T2 T T1 |
类似零件编号 - TL431XA3 |
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类似说明 - TL431XA3 |
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