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MT58L256L32F 数据表(PDF) 26 Page - Micron Technology |
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MT58L256L32F 数据表(HTML) 26 Page - Micron Technology |
26 / 27 page 26 8Mb: 512K x 18, 256K x 32/36 Flow-Through SyncBurst SRAM Micron Technology, Inc., reserves the right to change products or specifications without notice. MT58L512L18F_2.p65 – Rev. 7/00 ©2000, Micron Technology, Inc. 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH SYNCBURST SRAM 165-PIN FBGA NOTE: 1. All dimensions in millimeters MAX or typical where noted. MIN 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 10.00 14.00 15.00 ±0.10 1.00 (TYP) 1.00 (TYP) 5.00 ±0.05 13.00 ±0.10 PIN A1 ID PIN A1 ID BALL A1 MOLD COMPOUND: EPOXY NOVOLAC SUBSTRATE: PLASTIC LAMINATE 6.50 ±0.05 7.00 ±0.05 7.50 ±0.05 1.20 MAX SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb SOLDER BALL PAD: Ø .33mm SEATING PLANE 0.85 ±0.075 0.10 A A 165X Ø 0.45 BALL A11 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron is a registered trademark of Micron Technology, Inc. SyncBurst is a trademark of Micron Technology, Inc. |
类似零件编号 - MT58L256L32F |
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类似说明 - MT58L256L32F |
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