12

8Mb: 512K x 18, 256K x 32/36 3.3V I/O, Pipelined, DCD SyncBurst SRAM

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT58L512L18D_2.p65 – Rev. 8/00

©2000, Micron Technology, Inc.

8Mb: 512K x 18, 256K x 32/36

3.3V I/O, PIPELINED, DCD SYNCBURST SRAM

FBGA PIN DESCRIPTIONS (continued)

x18

x32/x36

SYMBOL

TYPE

DESCRIPTION

3C, 3D, 3E,

3C, 3D, 3E,

Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and

3F, 3G, 3J,

3F, 3G, 3J,

Operating Conditions for range.

3K, 3L, 3M,

3K, 3L, 3M,

3N, 9C, 9D,

3N, 9C, 9D,

9E, 9F, 9G,

9E, 9F, 9G,

9J, 9K, 9L,

9J, 9K, 9L,

9M, 9N

9M, 9N

2H, 4C, 4N, 5C, 2H, 4C, 4N, 5C,

Supply Ground: GND.

5D, 5E 5F,

5D, 5E 5F,

5G, 5H, 5J,

5G, 5H, 5J,

5K, 5L, 5M,

5K, 5L, 5M,

6C, 6D, 6E, 6F, 6C, 6D, 6E, 6F,

6G, 6H, 6J,

6G, 6H, 6J,

6K, 6L, 6M,

6K, 6L, 6M,

7C, 7D, 7E,

7C, 7D, 7E,

7F, 7G, 7H,

7F, 7G, 7H,

7J, 7K, 7L,

7J, 7K, 7L,

7M, 7N, 8C, 8N 7M, 7N, 8C, 8N

5P, 5R, 7P, 7R 5P, 5R, 7P, 7R

DNU

–

Do Not Use: These signals may either be unconnected or wired to

GND to improve package heat dissipation.

1A, 1B, 1C,

1A, 1B, 1P,

NC

–

No Connect: These signals are not internally connected and

1D, 1E, 1F,

2C, 2N,

may be connected to ground to improve package heat

1G, 1P, 2C,

2P, 2R, 3H,

dissipation. Pin 6N reserved for address pin expansion; 16Mb.

2J, 2K,

5N, 6N,

2L, 2M, 2N,

9H, 10C,

2P, 2R, 3H,

10H, 10N,

4B, 5A, 5N,

11A, 11B,

6N, 9H, 10C,

10D, 10E, 10F,

10G, 10H,

10N, 11B,

11J, 11K,

11L, 11M,

11N