X3G_T_OH047_048

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© NXP B.V. 2011. All rights reserved.

Product specification

Rev. 1 — 4 April 2011

14 of 19

NXP Semiconductors

X3G-OH047/8; X3T-OH047/8

Magnetic field sensor

[1]

Cumulate pitch error

0.2 over 10 pitch.

[2]

Carbon loaded polystyrene 100 % recyclable.

Cover tape

Width

 5.75

-

Film thickness

 0.1

-

Bending radius

In winding direction

R

 30

-

Fig 12. Tape outline, carrier tape X3T-OH047

Table 12.

Dimensions for Figure 12 “Tape outline, carrier tape X3T-OH047”

Item

Symbol

Specification

Dimension [mm]

Tolerance

Overall dimensions

Tape width

W

8

0.1

Distance

G

 0.75

-

Sprocket holes

Diameter

1.5

0.1

Distance

E

1.75

0.1

Pitch[1]

4

0.1

Table 11.

Item

Symbol

Specification

Dimension [mm]

Tolerance

T

A

B

W

δ

δ

detail Z

50:1

section

B-B

measurement method of

compartment dimensions

section

A-A

pad 1

feed direction

019aab729

B

G

Z

E

D

Θ