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L6100100 数据表(PDF) 1 Page - Semikron International |
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L6100100 数据表(HTML) 1 Page - Semikron International |
1 / 15 page SKYPER™ 32 - Technical Explanations 1 / 15 2005-06-03 – Rev04 © by SEMIKRON SKYPER™ 32 Technical Explanations Revision 04 Status: preliminary -------------------------------------------------------------------------------------------------------------------------------------------------------------------------- This Technical Explanation is valid for the following parts: part number type date code (YYWW) L6100100 SKYPER™ 32 ≥ 0519 Related documents: title version Data Sheet SKYPER™ 32 ≥ 03-06-2005 Prepared by: Markus Hermwille -------------------------------------------------------------------------------------------------------------------------------------------------------------------------- Content Application and Handling Instructions...................................................................................................................... 2 Further application support...................................................................................................................................... 2 General Description................................................................................................................................................. 2 Features of SKYPER™ 32 ...................................................................................................................................... 2 Block diagram.......................................................................................................................................................... 3 Dimensions.............................................................................................................................................................. 3 PIN Array – Primary Side......................................................................................................................................... 4 PIN Array – Secondary Side.................................................................................................................................... 5 Driver Performance ................................................................................................................................................. 6 Insulation ................................................................................................................................................................. 6 Auxiliary Power Supply............................................................................................................................................ 6 Under Voltage Protection of driver power supply (UVP).......................................................................................... 7 Input Signals............................................................................................................................................................ 8 Short Pulse Suppression (SPS)............................................................................................................................... 8 Failure Management................................................................................................................................................ 8 Shut Down Input (SDI)............................................................................................................................................. 9 Dead Time generation (Interlock TOP / BOT) (DT) ................................................................................................. 9 Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP).................................... 10 Adjustment of DSCP.............................................................................................................................................. 11 High Voltage Diode for DSCP................................................................................................................................ 12 Gate resistors ........................................................................................................................................................ 12 External Boost Capacitors (BC)............................................................................................................................. 13 Application Example .............................................................................................................................................. 13 Mounting Notes ..................................................................................................................................................... 14 Marking.................................................................................................................................................................. 15 Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to change without notice. This document supersedes and replaces all information previously supplied and may be supersede by updates. |
类似零件编号 - L6100100 |
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类似说明 - L6100100 |
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