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TPS7A02 数据表(PDF) 5 Page - Texas Instruments |
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TPS7A02 数据表(HTML) 5 Page - Texas Instruments |
5 / 43 page 5 TPS7A02 www.ti.com SBVS277B – JULY 2019 – REVISED MARCH 2020 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Maximum is VIN + 0.3 V or 5.5 V, whichever is smaller. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage VIN –0.3 6.5 V VEN –0.3 6.5 VOUT –0.3 VIN + 0.3 or 5.5 (2) Current Maximum output Internally limited A Temperature Operating junction, TJ –40 150 °C Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) Effective output capacitance of 0.5 µF minimum required for stability. (2) 22 µF is the maximum derated capacitance that can be used for stability. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 1.5 6.0 V VEN Enable voltage 0 6.0 V VOUT Output voltage 0.8 5.0 V IOUT Output current 0 200 mA CIN Input capacitor 1 µF COUT Output capacitor(1) (2) 1 1 22 µF FEN EN toggle frequency 10 kHz TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPS7A02 UNIT DQN (X2SON) DBV (SOT-23-5) YCH (DSBGA) 4 PINS 5 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 179.1 181.9 TBD °C/W RθJC(top) Junction-to-case(top) thermal resistance 137.6 53.0 TBD °C/W RθJB Junction-to-board thermal resistance 116.3 88.1 TBD °C/W ψJT Junction-to-top characterization parameter 6.1 27.1 TBD °C/W ψJB Junction-to-board characterization parameter 116.3 52.7 TBD °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance 112.3 N/A TBD °C/W |
类似零件编号 - TPS7A02_V06 |
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类似说明 - TPS7A02_V06 |
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