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LM393B 数据表(PDF) 5 Page - Texas Instruments |
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LM393B 数据表(HTML) 5 Page - Texas Instruments |
5 / 49 page 5 LM393B, LM2903B, LM193, LM293, LM293A, LM393, LM393A, LM2903, LM2903V www.ti.com SLCS005AC – OCTOBER 1979 – REVISED FEBRUARY 2020 Product Folder Links: LM393B LM2903B LM193 LM293 LM293A LM393 LM393A LM2903 LM2903V Submit Documentation Feedback Copyright © 1979–2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: LM193 THERMAL METRIC(1) LM193 UNIT D (SOIC) 8 pin RθJA Junction-to-ambient thermal resistance 126.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 70 °C/W RθJB Junction-to-board thermal resistance 64.9 °C/W ψJT Junction-to-top characterization parameter 20.3 °C/W ψJB Junction-to-board characterization parameter 64.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes) THERMAL METRIC(1) LM293, LM393, LM2903 UNIT D (SOIC) DGK (VSSOP) P (PDIP) PS (SO) PW (TSSOP) 8 pin 8 pin 8 pin 8 pin 8 pin RθJA Junction-to-ambient thermal resistance 131.8 199.4 73.7 139 194.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.4 90.2 62.6 98.9 77.0 °C/W RθJB Junction-to-board thermal resistance 72.2 120.8 50.8 83.7 123.0 °C/W ψJT Junction-to-top characterization parameter 26.5 21.5 39.2 47.4 13.1 °C/W ψJB Junction-to-board characterization parameter 71.1 119.1 50.7 83 121.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Thermal Information: LM393B and LM2903B THERMAL METRIC(1) LM393B, LM2903B UNIT D (SOIC) PW (TSSOP) DGK (VSSOP) DDF (SOT-23) DSG (WSON) 8 pin 8 pin 8 pin 8 pin 8 pins RθJA Junction-to-ambient thermal resistance 148.5 200.6 193.7 197.9 96.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 90.2 89.6 82.9 119.2 119.0 °C/W RθJB Junction-to-board thermal resistance 91.8 131.3 115.5 115.4 63.1 °C/W ψJT Junction-to-top characterization parameter 38.5 22.1 20.8 19.4 12.4 °C/W ψJB Junction-to-board characterization parameter 91.1 129.6 113.9 113.7 63.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance - - - - 37.8 °C/W |
类似零件编号 - LM393B |
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类似说明 - LM393B |
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